Simulation and Modeling of Piezoresistive Properties in Conductive Foams

Abstract

Conductive foams have emerged as a pivotal class of materials for flexible piezoresistive sensors, finding widespread applications in structural health monitoring, human motion detection, and advanced human-machine interfaces. Their functionality hinges on the piezoresistive effect, where mechanical deformation induces a measurable change in electrical resistance. Accurate prediction and optimization of this behavior necessitate sophisticated simulation and modeling techniques. This review provides a comprehensive overview of the current state-of-the-art in simulating the piezoresistive properties of conductive foams, with a particular focus on Finite Element Analysis (FEA) and COMSOL Multiphysics. We delve into the fundamental mechanisms governing piezoresistivity, the critical material and microstructural factors influencing sensor performance, and the advanced constitutive models required to capture the complex non-linear, viscoelastic, and hysteretic responses. Challenges associated with accurately representing foam microstructure, filler distribution, and time-dependent behavior are discussed, alongside strategies for enhancing simulation fidelity. Finally, the review highlights current limitations and outlines future directions for research in this rapidly evolving field, emphasizing the need for more comprehensive models and robust experimental validation.